Flexible electrical substrate

ABSTRACT

A flexible substrate layer haying metallic bus-lines and connecting stitches is formed. A trace layer haying electrical traces and thermal vias is also formed. The substrate layer and the trace layer are bonded together by way of respective thermal pathways and electrically interconnected. The resulting layer-wise assembly is configured to support and electrically interconnect an array of photovoltaic cells and to channel away heat during operation.

BACKGROUND

Photovoltaic cells, commonly referred to as “solar cells”, are receivingincreased attention as the pursuit of renewable energy solutionsadvances. Incident light causes the photovoltaic (PV) cell to produce anelectrical potential that can be combined with that of other PV cellsand used for charging storage batteries, energizing electronic devices,etc.

Typically, numerous PV cells are electrically coupled so as to define anarray capable of providing usable voltage and current output. It isdesirable to mass produce the supporting substrates and interconnectingcircuitry for arrays of PV cells such that the overall cost per watt ofgenerated power can be reduced relative to known techniques.

Accordingly, the embodiments described hereinafter were developed in theinterest of addressing the foregoing issues.

BRIEF DESCRIPTION OF THE DRAWINGS

The present embodiments will now be described, by way of example, withreference to the accompanying drawings, in which:

FIG. 1 depicts a plan view of a flexible substrate layer according to anembodiment;

FIG. 2 depicts a plan view of a trace layer according to an embodiment;

FIG. 3 depicts plan view of an assembly of layers according to anembodiment;

FIG. 4 depicts plan view of an assembly having photovoltaic cellsaccording to an embodiment;

FIG. 5 depicts a schematic view of a photovoltaic array according toanother embodiment;

FIG. 6 depicts a flow diagram of a method according to an embodiment;

FIG. 7 depicts a flow diagram of a method according to anotherembodiment;

FIG. 8A depicts a flow diagram of first portion of a method according toyet another embodiment;

FIG. 8B depicts a flow diagram of a second portion of the method of FIG.8A.

DETAILED DESCRIPTION Introduction

Means and methods for providing flexible and scalable photovoltaicarrays are provided by the present teachings. A flexible substrate layerhaving metallic bus-lines and connecting electrically-conductivestitches is formed. A trace layer having electrical traces and thermalvias is also formed. The substrate layer and the trace layer are bondedtogether by way of respective thermal pathways and electricallyinterconnected. The resulting layer-wise assembly is configured tosupport and electrically interconnect an array of photovoltaic cells andto channel away heat during operation. The assembly is scalable ineither or both width and length (i.e., X and Y) dimensions as desiredsuch that an array having overall electrical generating characteristicsis provided.

In one embodiment, a method includes forming a plurality of metal stripson a flexible material so as to define a first layer. The method alsoincludes forming a plurality of electrical traces and a plurality ofthermal vias on a metal foil so as to define a second layer.Additionally, the method includes bonding the first layer to the secondlayer by way of bonding the plurality of thermal vias to respective onesof the metal strips using a thermally conductive electricallynon-conductive adhesive. The method further includes removing the metalfoil, and electrically bonding at least some of the plurality ofelectrical traces to respective ones of the metal strips.

In another embodiment, an apparatus includes a flexible thermallyconductive electrically non-conductive material defining a substrate.The apparatus also includes a plurality of metallic strips supported bythe substrate. Additionally, the apparatus includes a plurality ofelectrical traces disposed over the strips. At least some of theelectrical traces are electrically bonded to respective ones of themetallic strips so as to define electrical bus-lines. The apparatusfurther includes a plurality of thermal vias disposed over and bonded torespective ones of the metallic strips so as to define heat spreaderbus-lines.

In yet another embodiment, an array of photovoltaic cells includes asubstrate of flexible and thermally conductive and electrically nonconductive material. The array also includes a plurality of electricallyconductive bus-lines disposed in parallel arrangement on the substrate.Additionally, a plurality of thermally-conductive heat spreaderbus-lines are disposed in parallel arrangement on the substrate. Thearray also includes a plurality of thermal vias bonded to respectiveones of the heat spreader bus-lines. The array further includes aplurality of electrical traces electrically coupled to respective onesof the electrically conductive bus-fines. At least some of theelectrical traces are disposed over and are electrically isolated fromrespective ones of the electrically conductive bus-lines.

First Illustrative Embodiment

FIG. 1 depicts a plan view of a substrate 100 according to oneembodiment. The substrate 100 is illustrative and non-limiting withrespect to the present teachings. Thus, other substrates can also bedefined, produced and used according to the present teachings.

The substrate 100 includes a sheet material 102. The sheet material 102is flexible in nature, is thermally conductive, and is electricallynon-conductive. That is, the sheet material 102 is a generally goodconductor of heat, while also being a good electrical insulator.Additionally, the sheet material 102 can be transparent, translucent oropaque. Non-limiting examples of the sheet material 102 include Arcticoncomposites as available from Ovation Polymers, Inc., Medina, Ohio, USA.The sheet material 102 can be of any suitable dimensions. In oneembodiment, the sheet material 102 is provided in roll form, having awidth of about one-hundred twenty-five millimeters and a total rolllength of about one-hundred meters with a thickness of two-hundredmicrons. Other suitable dimensions can also be used. As implied by thearrows A1 and A2 of FIG. 1, the sheet material 102 can continue ineither or both of these directions as desired.

The substrate 100 includes a plurality of metallic strips, or metalizedareas, 104. The metallic (metal) strips 104 define heat spreaderbus-lines that are supported on the flexible material 102. Illustrativeand non-limiting dimensions for the metallic strips 104 are fourmillimeters wide by forty microns thick. Length (i.e., along directionA1) of the metal strips 104 can be any suitable value depending on thefinished size of the substrate 100. The metal strips 104 can be formed(or grown) from any suitable metal or metallic material such as, fornon-limiting example, copper, aluminum, nickel, etc. Other metals and/ormaterials can also be used. Further description regarding the formationof the metal strips 104 is provided hereinafter.

The substrate 100 further includes metallic strips, or metalized areas,106A, 106B, 1060, 1060, 106E, 106F, 106G and 106H. The metallic (metal)strips 106A-106H define electrical bus-lines that are supported on theflexible material 102. In particular, the metal strips 106A-106H arefurther designated and non-limiting dimensions are provided according toTable 1 below:

TABLE 1 Bus-Lines Element Designation Width × Thickness 106A CommonCathode Bus 7 mm × 40 microns 106B Mid-Energy Tap Bus 7 mm × 40 microns106C Mid-Energy Anode Bus 7 mm × 40 microns 106D Low-Energy Anode Bus 2mm × 40 microns 106E Common Cathode Bus 7 mm × 40 microns 106FMid-Energy Tap Bus 7 mm × 40 microns 106G Mid-Energy Anode Bus 7 mm × 40microns 106H Low-Energy Anode Bus 2 mm × 40 microns

The metal strips (i.e., bus-lines) 106A-106H can be formed (or grown)from any suitable metal or metallic material such as, for non-limitingexample, copper, aluminum, nickel, etc. Other metals and/or materialscan also be used. Further description regarding the formation of themetal strips 106A-106H is provided hereinafter.

The substrate 100 further includes a pair of discontinuous (dashed orstitched) rows of metalized (metal or metallic) areas 108A and 108B. Themetal areas 108A-108B define respective low-energy stitch bus-lines 110Aand 110B. Illustrative and non-limiting dimensions for each of themetallic areas 108A and 108B are one millimeter wide by forty micronsthick. Length (i.e., along direction A1) of each row of the metal areas108A and 108B can be any suitable value depending on finished size ofthe substrate 100. The metal areas 108A and 108B can be formed (orgrown) from any suitable metal or metallic material such as, fornon-limiting example, copper, aluminum, nickel, etc. Other metals and/ormaterials can also be used. Further description regarding the formationof the metallic areas 108A-108B is provided hereinafter.

The substrate 100 is configured to provide a Flexible, support sheet towhich a plurality of photovoltaic cells is bonded. In turn, thephotovoltaic cells are electrically interconnected to respective ones ofeach other and the bus-lines 106A-106H and metal areas 108A-108B. Anarray of photovoltaic cells, having particular voltage and/or electricalcurrent generating characteristics, is thus defined. Furthermore, theheat spreader bus-lines 104 provide means for channeling heat away fromthe photovoltaic cells to an underlying heat sink or other heat transfermeans. Further description regarding the formation of the substrate 100is provided hereinafter.

FIG. 2 depicts a plan view of electrical traces and thermal vies,collectively referred to as a pattern 200, according to one embodiment.The pattern 200 is illustrative and non-limiting with respect to thepresent teachings. Thus, other patterns can also be defined, producedand used according to the present teachings.

The pattern 200 includes a supportive metal foil 202. The metal foil 202is typically—but not necessarily—flexible in nature. In one embodiment,the metal foil 102 is defined by type 316L stainless steel being of anysuitable dimensions. The metal foil 202 can be of any suitabledimensions. In one embodiment, the metal foil 202 is provided in rollform, having a width of about one-hundred twenty-five millimeters and atotal roll length of about one-hundred meters, with a thickness of fiftymicrons. Other suitable dimensions can also be used. As implied by thearrows A3 and A4 of FIG. 2, the metal foil 202 can continue in either orboth of these directions as desired.

The pattern 200 also includes a plurality of thermal vias 204. Each ofthe thermal vies is formed of metal or metallic material such as, fornon-limiting example, copper, aluminum, nickel, etc. Each thermal via204 is configured to transport heat away from photovoltaic cells (SeeFIG. 4) to respective ones of the heat spreader bus-lines 104. As such,each thermal via 204 is dimensionally defined according to the width ofthe heat spreader bus-line 104 to which it is bonded, and the width ofthe photovoltaic cell that is bonded to that thermal via 204. Thethermal vies 204 are of uniform thickness. In one embodiment, thethermal vies are forty microns in thickness. Other thickness dimensionscan also be used. The thermal vies 204 are supported on the metal foil202 until they are bonded to their respective heat spreader bus-lines104, the metal foil 202 being removed thereafter.

The pattern 200 also includes a plurality of electrical traces 206. Theelectrical traces 206 are formed of a conductive material such as, fornon-limiting example, copper, aluminum, nickel, etc. The electricaltraces 206 can also be formed from another suitable electricallyconductive material. In one embodiment, the thermal vias 204 and theelectrical traces 206 are formed from the same material. Each electricaltrace 206 is configured to be electrically bonded (i.e., coupled) to arespective one of the bus-lines 106A-106H or metal areas 108A-108B.Illustrative and non-limiting dimensions for the traces 206 arezero-point-five millimeters (i.e., 0.5 mm) in width, forty microns inthickness, and of varying length according to the respective electricalcoupling to be established.

The electrical traces 206 include or define an electrical contact pad208. Each contact pad 208 is configured to electrically coupled to oneor more other entities (described hereinafter) by way of wire-bonding.In the alternative, each contact pad 208 is configured to wrapped orbent into contact with another node or entity and electrically bondedthereto.

The pattern 200, being generally supported during formation on the metalfoil 202, is eventually joined to the substrate 100 so as to define anassembly. The assembly process is generally performed as follows: thesubstrate 100 and the pattern 200 are aligned in a facing orientationsuch that the sheet material 102 and the metal foil 202 face away fromeach other. The thermal vias 204 are bonded to respective ones of theheat spreader bus-lines 104 using a thermally conductive, electricallynon-conductive adhesive.

Once the adhesive is cured, the metal foil 202 is removed. Next, theelectrical traces 206 are electrically bonded to respective ones of thebus-lines 106A-106H or metal areas 108A-108B. In one embodiment, laserbonding is used to perform the electrical coupling. Further steps arealso performed as described in detail hereinafter. None the less, thepattern 200 of thermal vias 204 and electrical traces 206 is transferredonto the substrate 100.

FIG. 3 depicts a an view of an assembly 300 according to one embodiment.The assembly 300 is illustrative and non-limiting with respect to thepresent teachings. Thus, other assemblies can also be defined, producedand used according to the present teachings.

The assembly 300 includes the flexible material 102, which supports theheat spreader bus-lines 104, the bus-lines 106A-106H and the metal areas108A-108B. The assembly also includes the thermal vias 204, which havebeen bonded to respective heat spreader bus-lines 104 by way ofthermally conductive electrically non-conductive adhesive.

The assembly also includes the electrical traces 206. The electricaltraces 206 have been electrically bonded to respective ones of thebus-lines 106A-106H and the metal areas 108A-108B. Such bonds 302 can beformed, for non-limiting example, by laser welding. Other suitablemethods and/or means for electrically coupling (i.e., bonding) 302 theelectrical traces 206 to respective ones of the bus-lines 106A-106H andthe metal areas 108A-108B can also be used. It is noted that eachelectrical trace 206 is electrically bonded to only one of the bus-lines106A-106H or metal areas 108A-108B and is electrically isolated from allothers. In this way, numerous of the electrical traces 206 are disposedover and are isolated from one or more of the bus-lines 106A-106H and/ormetal areas 108A-108B. Index marks (or holes) 304 are formed on theflexible material 102 by way of; for non-limiting example, laserscribing or ablation. Other means for forming the index marks 304 canalso be used. Such index marks 304 are used for aligning theinstallation concentrating lenses, photovoltaic cells or other elementslater in assembling a complete photovoltaic array using the assembly300.

The assembly 300 includes all of the elements of the substrate 100 andthe pattern 200, less the metal foil 202 that has been removed. Theassembly 300 can be readily mass produced in a roll-to-roll, essentiallycontinuous process such that economies of scale can be leveraged. Theassembly 300 is configured to have numerous photovoltaic cells bondedthereto and to provide for electrically coupling those photovoltaiccells such that an array is defined.

FIG. 4 depicts a plan view of a photovoltaic array (array) 400 accordingto one embodiment. The array 400 is illustrative and non-limiting withrespect to the present teachings. Thus, other arrays can also bedefined, produced and used according to the present teachings. The array400 includes the assembly 300 as described above in regard to FIG. 3.

The array 400 also includes a plurality of mid-energy photovoltaic (PV)cells 402. The PV cells 402 are configured to exhibit (i.e., generate orproduce) an electrical potential in response to ambient electromagneticradiation (i.e., solar energy or light) above a predetermined band gap.For non-limiting example, the PV cells 402 are responsive to solarenergy above a band gap of one-point-eight electron-volts (i.e., 1.8eV). Other PV cells corresponding to other band gaps can also be used.Each of the PV cells 402 is bonded to and supported by way of arespective number of thermal vias 204 (See FIG. 3). The PV cells 402 arebonded to their respective thermal vias 204 by way of thermally allyconductive electrically non-conductive adhesive.

The array 400 also includes a plurality of low-energy photovoltaic (PV)cells 404. The PV cells 404 are configured to exhibit (i.e., generate orproduce) an electrical potential in response to ambient electromagneticradiation (i.e., solar energy or light) in another predeterminedspectral band. For non-limiting example, the PV cells 404 are responsiveto solar energy above a band gap of one-point-one-two electron-volts(i.e., 1.12 eV). Other PV cells corresponding to other band gaps canalso be used. Each of the PV cells 404 is bonded to and supported by wayof a respective number of thermal vies 204 (See FIG. 3). The PV cells404 are bonded to their respective thermal vias 204 by way of thermallyconductive electrically non-conductive adhesive.

The mid-energy PV cells 402 and the low-energy PV cells 404 areelectrically coupled to respective bus-lines 106A-106H or metal areas108A-108B. In some cases, wire bonds 406 are used as needed to completethe electrical coupling to respective ones of the electrical traces 206(See FIG. 3). In other cases, the contact pads 208 (See FIG. 2) ofrespective electrical traces 206 are electrically bonded to either thebottom side of a respective PV cell 402 or 404. In another embodiment,the contact pads 208 are formed so as to be wrapped and/or routed asneed and bonded to the top side of a respective PV cell 402 or 404. Suchdirect electrical connection of the contact pads 208 to respectivephotovoltaic cells or other electrical nodes is referred to herein as“tab-wrapping”. Electrical bonding can be performed by way ofelectrically conductive adhesive. Other suitable electrical bonding(coupling) techniques can also be used.

The electrical bonding is such that the photovoltaic cells 402 and 404define an array. The electrical voltage and current produced by thearray is accessible by suitable connection between and to the bus-lines106A-106H. Optical concentration elements or lenses (not shown) can beinstalled over the photovoltaic cells 402 and 404, making use of theindex marks 304. Other finishing steps can also be performed such thatthe assembly 300 is used to support and define a photovoltaic array.

Second Illustrative Embodiment

FIG. 5 is a schematic view depicting a photovoltaic array 500 accordingto another embodiment. The photovoltaic array 500 is illustrative andnon-limiting in nature. Other arrays according to the present teachingscan also be configured, manufactured and used.

The array 500 includes a plurality of low-energy photovoltaic cells 502.The photovoltaic cells 502 are electrically connected in series circuitarrangement of four cells 502 each. Within each series of four, an anode(i.e., positive polarity) of an end photovoltaic cell 502 is connectedto a node 504, while the cathode (i.e., negative polarity) of theopposite end photovoltaic cell 502 is connected to a node 506. In oneembodiment, each of the low-energy photovoltaic cells 502 produces aboutzero-point-five-five volts (i.e., 0.55V) under normal operatingconditions. Other photovoltaic cells exhibiting other respectiveoperating voltages can also be used.

The array 500 also includes a plurality of mid-energy photovoltaic cells508. The photovoltaic cells 508 are electrically connected in seriescircuit arrangement of two cells 508 each. Within each series of two, ananode (i.e., positive polarity) of an end photovoltaic cell 508 isconnected to a node 510, while the cathode (i.e., negative polarity) ofthe opposite end photovoltaic cell 508 is connected to the node 506.Additionally, a center tap location between each pair of photovoltaiccells 508 is connected to a node 512. In one embodiment, each of themid-energy photovoltaic cells 508 produces about one-point-one-two-fivevolts (i.e., 1.125V) under normal operating conditions. Otherphotovoltaic cells exhibiting other respective operating voltages canalso be used.

The respective nodes 504, 506, 510 and 512 are electrically connected toa connector 514. Thus, under normal use, the electrical potentialprovided by the array 500 can be coupled to other circuitry or devices(not shown) such as, for non-limiting example, power conditioningcircuitry, one or more rechargeable storage batteries, a communicationsdevice, a portable computing device, a global positioning system (GPS)receiver, etc.

The array 500 is illustrative of any number of photovoltaic arrays thatcan be configured and used in accordance with the present teachings.Thus, the respective photovoltaic cells 502 and 508 can be bonded torespective thermal vies 204 by way of thermally conductive electricallynon-conductive adhesive. Series-of-four arrangements of the photovoltaiccells 502 and series-of-two arrangements of the photovoltaic cells 508can be established by electrically coupling the respective photovoltaiccells 502 and 508 using wire bonds 406 and/or tab-wrapping. In turn, therespective series circuits that are established are electrically coupledto respective ones of the bus-lines 106A-106H and/or the metal areas108A-108B. The entire illustrative array 500 can be supported by theunderlying flexible material 102. The array 500 and numerous otherarrays (not shown) of respective configuration can be effectively massproduced in accordance with the present teachings.

First Illustrative Method

FIG. 6 is a flow diagram depicting a method according to one embodimentof the invention. The method of FIG. 6 includes particular operationsand order of execution. However, other methods including otheroperations, omitting one or more of the depicted operations, and/orproceeding in other orders of execution can also be used according tothe present teachings. Thus, the method of FIG. 6 is illustrative andnon-limiting in nature.

At 602, a flexible, thermally conductive and electrically non-conductivesheet material is coated on one side with a plating catalyst. Fornon-limiting example, the sheet material can be Arcticon composites asavailable from Ovation Polymers, Inc., and the plating catalyst can beCataposit 44 Catalyst as available from Rohm & Haas Co., Philadelphia,Penn., USA. In one embodiment, a roll-to-roll arrangement is used andthe sheet material is coated with the plating catalyst in portions in abatch-like process. In another embodiment, one entire side of the sheetmaterial is coated as a single step. Other arrangements can also beused. In one embodiment, the plating catalyst is applied as a layer lessthan one-hundred nanometers in thickness. Other thicknesses can also beused.

At 604, at laser is used to pattern the plating catalyst. In particular,the laser is used to ablate those areas where catalyst is not neededsuch that the remaining (i.e., undisturbed) plating catalyst definesareas for forming bus-lines (e.g., 104 and 106A-106H, etc.) and/or othermetallic areas (e.g., 108A-108B).

At 606, electroless plating is used to form a seed layer of metal withinthose areas of plating catalyst left intact after patterning at 604above. For non-limiting example, such a seed layer can be copper,aluminum, nickel, a metal alloy, etc. In one embodiment, the seed layeris one atom/molecule thick. Other thicknesses can also be used.

At 608, electroplating is used to form metal of desired thickness withinthe pattern areas bearing a seed layer. Such metal is the same as, orcompatible with, the metal or metal alloy used to form the seed layer.Thus, for non-limiting example, the patterned areas can be filled withcopper, aluminum, nickel, a metal alloy, etc., of desired thickness. Inone embodiment, the metal areas are formed to be forty microns thick.Other thicknesses can also be used. In this way, heat spreader bus-lines(e.g., 104), electrical bus-lines (e.g., 106A-106H) and metal areas or“stitches” (e.g., 108A-108B) are formed on the flexible material. Theflexible material, having the heat spreader bus-lines and electricalbus-lines and metal stitches formed thereon is referred to as a“substrate layer” or “substrate” for purposes herein.

Second Illustrative Method

FIG. 7 is a flow diagram depicting a method according to one embodimentof the invention. The method of FIG. 7 includes particular operationsand order of execution. However, other methods including otheroperations, omitting one or more of the depicted operations, and/orproceeding in other orders of execution can also be used according tothe present teachings. Thus, the method of FIG. 7 is illustrative andnon-limiting in nature.

At 702, a metal foil is coated on one side with a resin material. Fornon-limiting example, the metal foil can be cold-rolled 316L stainlesssteel foil as available from Outokumpu, Espoo, Finland. In turn, theresin can be Norland Optical Adhesive NOA83H as available from NorlandProducts, Inc., Cranbury, N.J., USA. In one embodiment, a roll-to-rollarrangement is used and the metal foil is coated with the resin in abatch-like process. In another embodiment, one entire side of the metalfoil is coated as a single step. Other arrangements can also be used. Inone embodiment, the resin is applied as a layer fifty microns inthickness. Other thicknesses can also be used.

At 704, a pattern is embossed into the resin while the resin is beingcured. In one embodiment, ultraviolet (UV) light is used to cure theresin. Other curing methods can also be used. The pattern embossed intothe resin defines numerous areas for forming electrical traces (e.g.,206) and thermal vias (e.g., 204).

At 706, a dry-etch process is used to expose the metal foil within theareas defined by the embossing at 704 above. For non-limiting example,an oxygen (O₂) dry etch can be used. Thus, resin is removed from theareas defined at 704 above. It is important to note that resin outsideof the embossed areas is left intact on the metal foil during and afterthe dry-etch process.

At 708, electroplating is used to form metal of desired thickness withinthe pattern areas where the metal foil is exposed. For non-limitingexample, the patterned areas can be filled with copper, aluminum,nickel, a metal alloy, etc., of desired thickness. In one embodiment,the metal areas are formed such that the resulting electrical traces areforty microns thick, while the thermal vias are forty microns thick.Other respective thicknesses can also be used. The metal areas areformed to be of slightly less thickness than the surrounding resin. Themetal foil (e.g., 202) now supports respective electrical traces (e.g.,206) and thermal vies (e.g., 204). The metal foil, having the electricaltraces and thermal vies and resin supported thereon is referred to as a“trace layer” or “top layer” for purposes herein.

Third Illustrative Method

FIGS. 8A and 8B collectively depict a flow diagram of a method accordingto one embodiment of the invention. The method of FIGS. 8A-8B includesparticular operations and order of execution. However, other methodsincluding other operations, omitting one or more of the depictedoperations, and/or proceeding in other orders of execution can also beused according to the present teachings. Thus, the method of FIGS. 8A-8Bis illustrative and non-limiting in nature.

At 802, a thermally conductive electrically non-conductive adhesive isapplied to the surface of the substrate layer, including the heatspreader bus-lines (e.g., 104) formed on a substrate layer, butexcluding the areas of subsequent electrical connection (vies). Forexample, such a substrate layer can be formed according to the method ofFIG. 6. In one embodiment, the thermally conductive electricallynon-conductive adhesive can be EP30AN as available from Master Bond,Inc., Hackensack, N.J., USA. Other suitable adhesives can also be used.

At 804, the substrate layer used at 802 above is aligned in facingorientation with a corresponding trace layer. For example, such a tracelayer can be formed according to the method of FIG. 7. Orientation issuch that the flexible material of the substrate layer and the metalfoil of the trace layer face are disposed away from each other.

At 806, the substrate layer and the trace layer are brought togetherwith the thermal vies (e.g., 204) of the trace layer making contact withthe adhesive born by the heat spreader bus-lines (e.g., 104) of thesubstrate layer. The thermal adhesive is cured so as to bond the thermalvias to respective heat spreader bus-lines. It is noted that at thispoint, the electrical traces (e.g., 206) of the traces layer are not incontact with any of the bus-lines (e.g., 106A-106H) or metal areas(e.g., 108A-108B). The electrical traces (e.g., 206) of the trace layerare supported in their respective places on the trace layer by way ofresin material.

At 808, the metal foil of the trace layer is removed. The resin remainsbehind and thus provides ongoing support for the electrical traces.

At 810, electrical traces (e.g., 206) are bonded to respective ones ofthe electrical bus lines (e.g., 106A-106H) and/or metal stitches (e.g.,108A-1083) by way of laser welding. Such bonds (e.g., 302) are formedsuch that the respective electrical traces make electrical contact withonly those bus-lines and/or metal areas as needed or desired.

At 812, index holes or marks (e.g., 304) are formed in the flexiblesubstrate material (e.g., 102) using a laser. Such index marks can beused for alignment and/or attachment of photovoltaic cells, opticalelements (lenses), or other assembly operations.

At 814, a thermally conductive electrically non-conductive adhesive isapplied to the thermal al vias (e.g., 204) previously bonded to the heatspreader bus-lines (e.g., 104). Thus, the adhesive presently applied isborn on outward facing surfaces of the thermal vies. In one embodiment,the thermally conductive electrically non-conductive adhesive can beEP30AN as available from Master Bond, Inc. Other suitable adhesives canalso be used.

At 816, an electrically conductive adhesive is applied to respectiveelectrical contact pads (e.g., 208) configured to be electrically bondedan anode or cathode of a respective low-energy photovoltaic cell (e.g.,404). In one embodiment, the thermally conductive electricallynon-conductive adhesive can be EMS 405-57-7 as available from EngineeredMaterials Systems, Inc., Delaware, Ohio, USA. Other suitable adhesivescan also be used. Attention is now directed to FIG. 8B.

At 818, respective photovoltaic cells (e.g., 402 and 404) are attachedto respective locations on the thermal vies (e.g., 204) and contact pads(e.g., 208) by way of the adhesive born on each. The photovoltaic cellsare thus fixedly bonded to the underlying flexible material (e.g., 102).

At 820, wire bonds (e.g., 406) are used to electrically connect thephotovoltaic cells to respective ones of the electrical traces (e.g.,206) such that a photovoltaic array is defined. For non-limitingexample, see the array 500 depicted in schematic form in FIG. 5. Inanother embodiment, some or all of the electrical interconnections canbe formed by tab-wrapping, wherein respective contact pads (e.g., 208)are electrically bonded to anode or cathode nodes of respectivephotovoltaic cells. Other suitable connections can also be used.

At 822, the photovoltaic array defined at 820 above is thermally bondedto a supporting structure such as, for non-limiting example, an aluminumheat sink. Thus, the supporting structure (e.g., heat sink) is bonded tothe previously unused side of the substrate flexible material (e.g.,102). Bonding to an underlying heat sink or other structure typicallygives the overall photovoltaic array rigidity and structural strength.

At 824, concentrating lenses, electrical connectors, and/or otherelements are connected to the photovoltaic array assembled at 800through 822 above. The photovoltaic array, using substrate layer andtrace layer construction techniques according to the present teachings,is now complete.

In general, the foregoing description is intended to be illustrative andnot restrictive. Many embodiments and applications other than theexamples provided would be apparent to those of skill in the art uponreading the above description. The scope of the invention should bedetermined, not with reference to the above description, but shouldinstead be determined with reference to the appended claims, along withthe full scope of equivalents to which such claims are entitled. It isanticipated and intended that future developments will occur in the artsdiscussed herein, and that the disclosed systems and methods will beincorporated into such future embodiments. In sum, it should beunderstood that the invention is capable of modification and variationand is limited only by the following claims.

1. A method, comprising: forming a plurality of metal strips on aflexible material so as to define a first layer; forming a plurality ofelectrical traces and a plurality of thermal vias on a metal foil so asto define a second layer; bonding the first layer to the second layer byway of bonding the plurality of thermal vias to respective ones of themetal strips using a thermally conductive electrically non-conductiveadhesive; removing the metal foil; and electrically bonding at leastsome of the plurality of electrical traces to respective ones of themetal strips.
 2. The method according to claim 1, the flexible materialfurther defined by a flexible thermally-conductive electricallynon-conductive material.
 3. The method according to claim 1, at leastsome of the metal strips defining heat spreader bus-lines, the thermalvias being bonded to respective ones of the heat spreader bus-linesusing the thermally conductive electrically non-conductive adhesive. 4.The method according to claim 1, the thermal vias and the electricaltraces being formed from a same metal
 5. The method according to claim 1further comprising: applying a plating catalyst to the flexiblematerial; patterning the plating catalyst so as to define plural areas;electroless plating so as to form a seed layer within each of the pluralareas; and electroplating over the seed layers so as to form theplurality of metal strips on the flexible material.
 6. The methodaccording to claim 1 further comprising: applying a resin to the metalfoil; embossing and curing the resin so as to define plural areas;etching the resin so as to expose the metal foil within each of theplural areas; and electroplating within the plural areas to as to formthe plurality of electrical aces and the plurality of thermal vias. 7.The method according to claim 1 further comprising bonding a pluralityof photovoltaic elements to respective ones of the thermal vias usingthermally conductive adhesive.
 8. The method according to claim 7further comprising: electrically coupling the photovoltaic elements torespective ones of the electrical traces so as to define a photovoltaicarray.
 9. The method according to claim further comprising bonding theflexible material to a heat sink. 10-15. (canceled)